By 2015, it is expected that more than a third of all wire bonding machines in use will be set up for copper. While possessing higher thermal and electrical conductivity than gold, copper had previously been seen as less reliable due to its hardness and susceptibility to corrosion. This change has been instigated by the rising cost of gold and the comparatively stable, and much lower, cost of copper. The wire bonding industry is transitioning from gold to copper. Wire diameters start from under 10 μm and can be up to several hundred micrometres for high-powered applications. Materials īondwires usually consist of one of the following materials: Wire bonding can be used at frequencies above 100 GHz.

Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Inside a wire bonded BGA package this package has an Nvidia GeForce 256 GPU

Wire library memory